School of Mechanical and Power Engineering, East China University of Science and Technology, Shanghai 200237, China
| Abstract: | To achieve rapid and efficient manufacturing of reliable flexible circuits, this paper analyzes the wettability of Galinstan liquid metal with traditional electronic component pins and proposes a flexible circuit fabrication scheme based on a direct molding method using 3D printing with DLP technology. Stretch resistors and analog switch circuits fabricated by this method were tested under stretching and twisting conditions. The results show that for liquid metals exposed to air and wrapped with an oxide film, it is difficult to wet the pins of electronic components. By using a NaOH solution to encapsulate Galinstan, the rapid wettability of the pins of electronic components can be achieved, which can be completed in 2 seconds; The contact angle after infiltration has been increased from 131.5° to 19.7° and can be repeatedly wetted, confirming that Galinstan is a flexible circuit conductor material compatible with traditional electronic components. Additionally, the stretching curve of the flexible circuits made using the method proposed in this paper can be with a first-order function; It still has a stable resistance value, after 1000 stretching release cycles; The analog switch circuit can still working under 50% tension and 180 ° torsion. This indicates that the circuits good linearity, stability, and repeatability, effectively enabling the fabrication of flexible sensing elements and circuits, and providing a new approach for small-scale production of personalized electronic circuits. |
| Keywords: | Liquid Metal, Flexible Circuits, 3D Printing, Wettability, Flexible Resin |
| DOI: | 10.57237/j.mater.2023.02.001 |
| [1] | JEONG S H, HAGMAN A, HJORT K, et al. Liquid alloy printing of microfluidic stretchable electronics [J]. Lab on a Chip, 2012, 12 (22): 4657-4664. |
| [2] | 杨锦斌. 基于液态金属的柔性电极电路的设计、制造及应用 [D]. 深圳大学, 2018. |
| [3] | Wang Q, Yu Y, Yang J, et al. Fast fabrication of flexible functional circuits based on liquid metal dual-trans printing [J]. Adv Mater, 2015, 27 (44): 7109~7116. |
| [4] | 穆世鹏. 银/聚苯胺/涤纶复合材料的制备及其性能研究. [D], 东华大学, 2016. |
| [5] | 李兰倩. 基于炭黑和碳纳米管导电棉织物的制备与表征[D], 西南大学, 2018. |
| [6] | 王瑾, 缪旭红. 基于织物的柔性电路制备方法及应用研究进展 [J]. 研究与技术, 2021 (03), 031107. |
| [7] | 温泽明, 代国亮, 陈剑英等液态金属涂覆的弹性导电纱线的制备及性能 [J]. 北京服装学院学报(自然科学版)2020, 40 (3): 9-14. |
| [8] | 王磊, 刘静.液态金属印刷电子墨水研究进展[J].影像科学与光化学, 2014, 32 (4): 382~392. |
| [9] | Guangyong Li, Xuan Wu, Dong-Weon Lee. Selectively plated stretchable liquid metal wires for transparent electronics [J]. Sensors and Actuators B: Chemical, 221 (2015) 1114-1119. |
| [10] | Pedro Alhais Lopes, Bruno C. Santos, Anibal T. de Almeida, et al. Reversible Polymer-Gel Transition for Ultra-Stretchable Chip-Integrated Circuits Through Self-Soldering and Self-Coating and Self-Healing [J]. Nature Communications, 2021, 12 (1): 4666. |
| [11] | Kim D-H, Ahn J-H, Choi W M, et al. Stretchable and Foldable Silicon Integrated Circuits [J]. Science, 2008, 320 (5875): 507-511. |
| [12] | Rogers J A, Someya T, Huang Y. Materials and Mechanics for Stretchable Electronics [J]. Science, 2010, 327 (5973): 1603-1607. |
| [13] | Tingyi Liu, Prosenjit Sen, and Chang-Jin. Characterization of Nontoxic Liquid-Metal Alloy Galinstan for Applications in Microdevices. Journal of microelectromechanical systems, 2012. 21 (2). 443-450. |
| [14] | 于志强 元器件引脚镀层与焊料对焊点质量影响分析 [C]. 第十一届中国高端SMT学术会议论文集 2017.11. |
| [15] | Rebecca K. Kramer, Carmel Majidi, and Robert J. Wood. Masked Deposition of Gallium-Indium Alloys for Liquid-Embedded Elastomer Conductors [J]. Adv. Funct. Mater. 2013, 23, 5292–5296. |
| [16] | Kadri Bugra Ozutemiz, James Wissman, Osman Burak Ozdoganlar, et al. EGaIn–Metal Interfacing for Liquid Metal Circuitry and Microelectronics Integration [J]. Adv. Mater. Interfaces 2018, 1701596. |
| [17] | Pineda F, Bottausci F, Icard B, et al. Using electrofluidic devices as hyper-elastic strain sensors: experimental and theoretical analysis [J]. Microelectronic Engineering, 2015, 144: 27-31. |
| [18] | 陈杨钟. 基于液态金属图案化的柔性电路及传感器研制[D]. 广东工业大学. 2021. |
| [19] | Park Y, Chen B, Wood R J. Design and fabrication of soft artificial skin using embedded microchannels and liquid conductors [J]. IEEE Sensors Journal, 2012, 12 (8): 2711-2718. |
| [20] | Suin Kim. Consistent and Reproducible direct ink writing of eutectic Gallium - Indium for high-quality soft sensors [J]. 2018, 5 (5): 601-612. |
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